Hybrid
Memory Cube and High-Bandwidth Memory Market Research Report – by memory
type ( HMC, HBM), by product ( CPU, FPGA, GPU, ASIC), by application areas
(HPC, networking and telecommunication, consumer electronics) region – Forecast
till 2023
Market Synopsis
Hybrid memory cube (HMC) and high bandwidth memory (HBM) are
both RAM interfaces designed and architecture by AMD and Hynix, and Silicon
Vias. Both the RAM interfaces work for stacked DRAM memory. High bandwidth
memory is used in combination with a graphics processing unit.
Both the interface for RAM work on similar lines, however,
high bandwidth memory has a slightly different architecture as compared to HMC.
HBM uses a graphical processing unit included in the same package as that of
the RAM, which makes HBM more advantageous over HMC to provide a
tightly-coupled high-speed processing unit. Hybrid memory cube devices tend to
use a separate processor like a chain, to multiply the memory capacity of the
device.
One of the major factors that contribute towards the growth
of hybrid memory cube and high bandwidth memory devices is the application of
these in data centers, smartphones, and high-end computation devices. The
architectural design of both the devices is similar in addition to the
graphical processing unit in HBM.
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Segmentation
The global hybrid memory cube and high-bandwidth memory
market are segmented into memory type, product type, application, and region.
On the basis of memory type, the segment is further classified into hybrid
memory cube (HMC) and high-bandwidth memory (HBM). On the basis of product type
the segment is further classified into central processing unit (CPU), field
programmable gate array (FPGA), graphics processing unit (GPU),
application-specific integrated circuit and accelerated processing unit. The
hybrid memory cube and high-bandwidth memory devices are applied in many areas
like high-performance computing (HPC), networking and telecommunication,
consumer electronics, data centers and many others.
The global hybrid memory cube and high-bandwidth memory
market is expected to reach USD 3.7 billion at CAGR 35% through the forecast
period 2023
Regional Analysis
The global hybrid memory cube and high-bandwidth memory
market are studied for North America, Europe, Asia Pacific and rest of the
world. Among the regions, the market of hybrid memory cube and high bandwidth
memory is dominated by North America. The major factor contributing towards the
growth of the market in North America is the high number of data centers and
their application. There is also a strong demand for high-performance
computing; wherein, the hybrid memory cube is expected to play a significant
role. In addition to the higher concentration of data centers in North America
region, faster adoption of newer technology in various applications is also
fuelling the market. The United States is the major contributor to the growth
of the market. The U.S. holds a large concentration of companies and vendors
dealing in hybrid memory cube and high bandwidth memory. There are also many
other start-ups which are entering the market.
On the other hand, the market in Europe is also expected to
boom after the mid of forecast period. Due to advancement in autonomous
vehicles, the hybrid memory cube and high bandwidth memory are expected to
contribute a significant amount to its development. However, Asia Pacific is
expected to show highest growth rate during the forecast period.
Some of the key players in the global hybrid memory cube and
high-bandwidth memory market are IBM Corporation (U.S.), Micron Technology,
Inc.(U.S.), Samsung Group (South Korea), SK Hynix Inc. (South Korea), Advanced
Micro Devices, Inc. (U.S.), Intel Corporation (U.S.), Xilinx, Inc.(US.),
Fujitsu Ltd.(Japan), Nvidia Corporation (U.S.), Open-Silicon (U.S.) and many
others.
Some of the key innovators in the area of hybrid memory cube
and high-bandwidth memory market are Cadence Design Systems, Inc. (U.S.), Arira
(U.S.), Marvell Technology Group, Ltd. (U.S.), Cray Inc.(U.S.), Rambus Inc.
(U.S.), Arm Holdings (U.K), Taiwan Semiconductor Manufacturing Company, Ltd.
(Taiwan) and many others.
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Intended Audience
- 3D interconnect vendors
- System integrators
- Government institutions
- Technology investors
- Research firms
- Memory Providers
- Key players in HBM market
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